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Please use this identifier to cite or link to this item: http://idr.iitbbs.ac.in/jspui/handle/2008/988
Title: Belle II SVD ladder assembly procedure and electrical qualification
Authors: Adamczyk K.
Aihara H.
Angelini C.
Aziz T.
Babu V.
Bacher S.
Bahinipati S.
Barberio E.
Baroncelli T.
Basith A.K.
Batignani G.
Bauer A.
Behera P.K.
Bergauer T.
Bettarini S.
Bhuyan B.
Bilka T.
Bosi F.
Bosisio L.
Bozek A.
Buchsteiner F.
Casarosa G.
Ceccanti M.
?ervenkov D.
Chendvankar S.R.
Dash N.
Divekar S.T.
Dole�al Z.
Dutta D.
Forti F.
Friedl M.
Hara K.
Higuchi T.
Horiguchi T.
Irmler C.
Ishikawa A.
Jeon H.B.
Joo C.
Kandra J.
Kang K.H.
Kato E.
Kawasaki T.
Kody� P.
Kohriki T.
Koike S.
Kolwalkar M.M.
Kvasni?ka P.
Lanceri L.
Lettenbicher J.
Mammini P.
Mayekar S.N.
Mohanty G.B.
Mohanty S.
Morii T.
Nakamura K.R.
Natkaniec Z.
Negishi K.
Nisar N.K.
Onuki Y.
Ostrowicz W.
Paladino A.
Paoloni E.
Park H.
Pilo F.
Profeti A.
Rao K.K.
Rashevskaya I.
Rizzo G.
Rozanska M.
Sandilya S.
Sasaki J.
Sato N.
Schultschik S.
Schwanda C.
Seino Y.
Shimizu N.
Stypula J.
Tanaka S.
Tanida K.
Taylor G.N.
Thalmeier R.
Thomas R.
Tsuboyama T.
Uozumi S.
Urquijo P.
Vitale L.
Volpi M.
Watanuki S.
Watson I.J.
Webb J.
Wiechczynski J.
Williams S.
W�rkner B.
Yamamoto H.
Yin H.
Yoshinobu T.
Keywords: Belle II
Double sided silicon strip detector
Origami
Silicon vertex detector
Issue Date: 2016
Abstract: The Belle II experiment at the SuperKEKB asymmetric collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules. � 2015 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.nima.2015.08.067
http://10.10.32.48:8080/jspui/handle/2008/988
Appears in Collections:Research Publications

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