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Please use this identifier to cite or link to this item: http://idr.iitbbs.ac.in/jspui/handle/2008/954
Title: A bonding study toward the quality assurance of Belle-II silicon vertex detector modules
Authors: Kang K.H.
Jeon H.B.
Park H.
Uozumi S.
Adamczyk K.
Aihara H.
Angelini C.
Aziz T.
Babu V.
Bacher S.
Bahinipati S.
Barberio E.
Baroncelli T.
Basith A.K.
Batignani G.
Bauer A.
Behera P.K.
Bergauer T.
Bettarini S.
Bhuyan B.
Bilka T.
Bosi F.
Bosisio L.
Bozek A.
Buchsteiner F.
Casarosa G.
Ceccanti M.
?ervenkov D.
Chendvankar S.R.
Dash N.
Divekar S.T.
Dole�al Z.
Dutta D.
Forti F.
Friedl M.
Hara K.
Higuchi T.
Horiguchi T.
Irmler C.
Ishikawa A.
Joo C.W.
Kandra J.
Kato E.
Kawasaki T.
Kody� P.
Kohriki T.
Koike S.
Kolwalkar M.M.
Kvasni?ka P.
Lanceri L.
Lettenbicher J.
Mammini P.
Mayekar S.N.
Mohanty G.B.
Mohanty S.
Morii T.
Nakamura K.R.
Natkaniec Z.
Negishi K.
Nisar N.K.
Onuki Y.
Ostrowicz W.
Paladino A.
Paoloni E.
Pilo F.
Profeti A.
Rao K.K.
Rashevskaia I.
Rizzo G.
Rozanska M.
Sandilya S.
Sasaki J.
Sato N.
Schultschik S.
Schwanda C.
Seino Y.
Shimizu N.
Stypula J.
Tanaka S.
Tanida K.
Taylor G.N.
Thalmeier R.
Thomas R.
Tsuboyama T.
Urquijo P.
Vitale L.
Volpi M.
Watanuki S.
Watson I.J.
Webb J.
Wiechczynski J.
Williams S.
W�rkner B.
Yamamoto H.
Yin H.
Yoshinobu T.
Keywords: Belle-II
DSSD
Origami
Pitch adapter
SVD
Wire bonding
Issue Date: 2016
Abstract: A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor �Origami� method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force. � 2016 Elsevier B.V.
URI: http://dx.doi.org/10.1016/j.nima.2016.03.075
http://10.10.32.48:8080/jspui/handle/2008/954
Appears in Collections:Research Publications

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